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Huneed Technologies, signed MOU with a Global Avionics Manufacturer Rockwell Collins for Business Cooperation

October 22, 2015

 

Huneed Technologies (KOSPI 005870, www.huneed.com / CEO JongSeok Shin) announced that they have signed the Memorandum of Understanding (MOU) with Rockwell Collins, a global avionics manufacturer that is headquartered in the United States, for business cooperation.


The MOU focuses on creating and strengthening synergy in business development and cooperation between the two companies in providing avionics solutions to a variety of aircraft development and production programs including but not limited to Light Civil Helicopter (LCH). 

The MOU was signed on 22nd of October in the presence of James Walker, Etienne Gomez at Huneed’s exhibition stand during Seoul International Aerospace & Defense Exhibition (Seoul ADEX 2015) held in Seoul Airport, Seongnam Gyeonggi-do.


The vision of Huneed, a distinguished Aerospace and Defense SME company in Korea, is to become a leading player in the avionics sector through a close cooperation with Rockwell Collins.


Mr. JongSeok Shin, CEO of Huneed, responded that Huneed will continue to grow in the aerospace market through business cooperation with Rockwell Collins as well as through strategic partnership with Boeing, Airbus and other Global A&D companies.

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